shawn
8080ef8940
- Generated complete PCB file via pcbnew API (KiCad 9.0 format) - All 22 components placed: J1 (2x20 header), U1 (AMS1117), C1-C4 (decoupling), J2 (input jack), U2 (TL072), R1-R4 (preamp), C5 (DC-block), U3 (PCM1808), C6-C7 (ADC decap), U4 (PCM5102), C8-C9 (DAC decap), R5/C10 (output filter), J3 (output jack), R6 (buffer feedback) - GND flood fill on both layers - DRC: 14 minor warnings (solder mask bridges + outline intersections — expected) - Gerbers exported: 9 layers + NC drill + JLCPCB CPL file - Handoff doc: hardware/I2S-HAT-HANDOFF.md
125 lines
2.6 KiB
Plaintext
125 lines
2.6 KiB
Plaintext
{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "9.0.8+dfsg-1"
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},
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"CreationDate": "2026-06-09T19:00:41-04:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "pi-multifx-hat",
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"GUID": "70692d6d-756c-4746-9966-782d6861742e",
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"Revision": "1.0"
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},
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"Size": {
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"X": 65.2,
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"Y": 56.2
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},
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"LayerNumber": 2,
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"BoardThickness": 1.6,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.2,
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"PadToTrack": 0.2,
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"TrackToTrack": 0.2
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}
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],
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"FilesAttributes": [
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{
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"Path": "pi-multifx-hat-F_Cu.gtl",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "pi-multifx-hat-B_Cu.gbl",
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"FileFunction": "Copper,L2,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "pi-multifx-hat-F_Paste.gtp",
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"FileFunction": "SolderPaste,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "pi-multifx-hat-B_Paste.gbp",
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"FileFunction": "SolderPaste,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "pi-multifx-hat-F_Silkscreen.gto",
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"FileFunction": "Legend,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "pi-multifx-hat-B_Silkscreen.gbo",
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"FileFunction": "Legend,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "pi-multifx-hat-F_Mask.gts",
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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},
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{
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"Path": "pi-multifx-hat-B_Mask.gbs",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "pi-multifx-hat-Edge_Cuts.gm1",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.51,
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"Material": "FR4",
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"Name": "F.Cu/B.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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