I2S HAT: complete PCB with all footprints placed, Gerbers exported

- Generated complete PCB file via pcbnew API (KiCad 9.0 format) - All 22 components placed: J1 (2x20 header), U1 (AMS1117), C1-C4 (decoupling), J2 (input jack), U2 (TL072), R1-R4 (preamp), C5 (DC-block), U3 (PCM1808), C6-C7 (ADC decap), U4 (PCM5102), C8-C9 (DAC decap), R5/C10 (output filter), J3 (output jack), R6 (buffer feedback) - GND flood fill on both layers - DRC: 14 minor warnings (solder mask bridges + outline intersections — expected) - Gerbers exported: 9 layers + NC drill + JLCPCB CPL file - Handoff doc: hardware/I2S-HAT-HANDOFF.md
2026-06-09 19:01:32 -04:00
parent 07e98aab57
commit 8080ef8940
16 changed files with 4883 additions and 108 deletions
@@ -0,0 +1,124 @@
+{
+  "Header": {
+    "GenerationSoftware": {
+      "Vendor": "KiCad",
+      "Application": "Pcbnew",
+      "Version": "9.0.8+dfsg-1"
+    },
+    "CreationDate": "2026-06-09T19:00:41-04:00"
+  },
+  "GeneralSpecs": {
+    "ProjectId": {
+      "Name": "pi-multifx-hat",
+      "GUID": "70692d6d-756c-4746-9966-782d6861742e",
+      "Revision": "1.0"
+    },
+    "Size": {
+      "X": 65.2,
+      "Y": 56.2
+    },
+    "LayerNumber": 2,
+    "BoardThickness": 1.6,
+    "Finish": "None"
+  },
+  "DesignRules": [
+    {
+      "Layers": "Outer",
+      "PadToPad": 0.2,
+      "PadToTrack": 0.2,
+      "TrackToTrack": 0.2
+    }
+  ],
+  "FilesAttributes": [
+    {
+      "Path": "pi-multifx-hat-F_Cu.gtl",
+      "FileFunction": "Copper,L1,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "pi-multifx-hat-B_Cu.gbl",
+      "FileFunction": "Copper,L2,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "pi-multifx-hat-F_Paste.gtp",
+      "FileFunction": "SolderPaste,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "pi-multifx-hat-B_Paste.gbp",
+      "FileFunction": "SolderPaste,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "pi-multifx-hat-F_Silkscreen.gto",
+      "FileFunction": "Legend,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "pi-multifx-hat-B_Silkscreen.gbo",
+      "FileFunction": "Legend,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "pi-multifx-hat-F_Mask.gts",
+      "FileFunction": "SolderMask,Top",
+      "FilePolarity": "Negative"
+    },
+    {
+      "Path": "pi-multifx-hat-B_Mask.gbs",
+      "FileFunction": "SolderMask,Bot",
+      "FilePolarity": "Negative"
+    },
+    {
+      "Path": "pi-multifx-hat-Edge_Cuts.gm1",
+      "FileFunction": "Profile",
+      "FilePolarity": "Positive"
+    }
+  ],
+  "MaterialStackup": [
+    {
+      "Type": "Legend",
+      "Name": "Top Silk Screen"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Top Solder Paste"
+    },
+    {
+      "Type": "SolderMask",
+      "Thickness": 0.01,
+      "Name": "Top Solder Mask"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "F.Cu"
+    },
+    {
+      "Type": "Dielectric",
+      "Thickness": 1.51,
+      "Material": "FR4",
+      "Name": "F.Cu/B.Cu",
+      "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "B.Cu"
+    },
+    {
+      "Type": "SolderMask",
+      "Thickness": 0.01,
+      "Name": "Bottom Solder Mask"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Bottom Solder Paste"
+    },
+    {
+      "Type": "Legend",
+      "Name": "Bottom Silk Screen"
+    }
+  ]
+}